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bulk silicon中文是什么意思

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  • 例句與用法
  • The corrosion rate of porous silicon in hf / h2o2 solution is several orders higher than that of bulk silicon
    多孔硅在hf / h _ 2o _ 2溶液中的腐蝕速率比體硅的高幾個數(shù)量級。
  • Bulk silicon , with indirect band gap of 1 . 12 ev , does n ' t emit visible light at room temperature
    本體硅為間接禁帶半導體,且禁帶寬度比較窄( 1 . 12ev ) ,在室溫下很難發(fā)可見光。
  • The mechanism of the luminescence has been discussed . bulk silicon , with indirect band gap of 1 . 12ev does n ' t emit light at room temperature
    本體硅為間接禁帶半導體,且禁帶寬度較窄,室溫下很難發(fā)光。
  • With a broaden and likely direct band gap , porous silicon has a different band structure to that of the bulk silicon . thus the porous silicon can emit at room temperature
    多孔硅改變了體硅的能帶結(jié)構(gòu),使禁帶展寬,并由間接帶隙向直接帶隙轉(zhuǎn)變,實現(xiàn)了室溫發(fā)光。
  • With a broad and likely direct band gap , porous silicon has a different band structure from that of the bulk silicon . thus the porous silicon can emit visible light at room temperature
    多孔硅改變了本體硅的能帶結(jié)構(gòu),使禁帶寬度展寬,并由間接禁帶向直接禁帶轉(zhuǎn)變,實現(xiàn)了室溫發(fā)光。
  • A method to make blazed silicon gratings is designed . the fabrication of ( 100 ) and ( 111 ) silicon wafer grating is performed by bulk silicon techniques . the surfaces of silicon gratings have been tested by afm
    設計了一種制作閃耀硅光柵的方法,利用體硅加工技術(shù)分別進行了( 100 )面硅片和( 111 )面硅片光柵的制作,對光柵的表面進行了測試。
  • The micromechanical comb - capacitive accelerometers fabricated by bulk silicon micromachining process are widely used for having simple process , small temperature coefficient , good stability and easily controllable damping coefficient
    用體硅微機械工藝制作的梳齒電容式傳感器有制作工藝簡單、溫度系數(shù)小、穩(wěn)定性好、阻尼系數(shù)容易控制等優(yōu)點,因而應用廣泛。
  • In the dissertation , a micromechanical comb capacitive accelerometer having u - shaped supporting beams is designed , simulated and fabricated on the base of the anodic bonding between the silicon and glass , and bulk silicon micromachining process
    而改用體硅微機械制作可以改善這些問題。本文設計、模擬并制作了一種基于硅一玻璃鍵合工藝的u型梁支撐的微機械電容式加速度計。
  • The different kinds of pyroelectric sensors were prepared on the porous silicon dioxide , plastic film and bulk silicon substrates respectively . the nanocomposite pclttp ( vdf - trfe ) film was deposited by spin - coating used as the sensing film , and ni - cr film was chosen as upper electrode and absorb layer
    分別在多孔氧化硅、 pet塑料和硅襯底上,制備納米陶瓷/ p ( vdf - trfe )復合敏感膜的熱釋電單元傳感器。
  • In the new structure , a n + buffer layer is introduced into the bulk silicon substrate with a triple - diffusion process . . the new structure has two features : one is the feature of npt - igbt : the thin and lightly - doped p + layer and the high lifetimes of the carriers ; the other is the feature of pt - igbt : n7n + structure which can make the n " region very thin
    新結(jié)構(gòu)用三重擴散的方法在n ~ -單晶片上引入了n ~ +緩沖層,仍然保留了npt - igbt中薄而輕摻雜p層和高載流子壽命的本質(zhì)優(yōu)點,同時又具有pt - igbt中n ~ - ( n ~ + )雙層復合的薄耐壓層(即薄基區(qū))的優(yōu)點。
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